The massification of high-computational applications, such as Artificial Intelligence (AI), is steering the semiconductor industry from monolithic to chiplet-based design architectures. In this new design philosophy, various chip functions once housed within a single large die are now segregated into modular smaller dies, called chiplets, that can be combined in a larger system.

As chiplets offer enhanced scalability, flexibility, and cost-effectiveness, they also present new challenges, particularly in die-to-die (D2D) communication. This presentation delves into the key attributes of electrical specification of the UCIe standard, and how to leverage EDA software to analyze the electrical layer efficiently.